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PCB Glossary-2
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Backplanes or Backpanels

Complex, multi-layer printed circuit boards used to connect racks of other boards in an electronics rack or enclosure.

 

Ball Grid Array (BGA)

A SMD package in which solder ball interconnects cover the bottom surface of the package.

 

Bare Board

An unassembled (unpopulated) printed board.

 

Base Copper

The thin copper foil portion of a copper-clad laminate for PCBs. It can be present on one or both sides of the board.

 

Base Material

The insulating material upon which a conductive pattern may be formed. It may be rigid or flexible or both. It may be a dielectric or insulated metal sheet.

 

Base Material Thickness

The thickness of the base material excluding metal foil or material deposited on the surface.

 

BBT - Bare Board Test.

 

Bed of Nails

A test fixture consisting of a frame and a holder containing a field of spring-loaded pins that make electrical contact with a planar test object.

 

 

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