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PCB Glossary-3
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Bill of materials (BOM)

A comprehensive listing of all subassemblies, components, and raw materials that go into a parent assembly, showing the quantity of each required to make the assembly.

 

Blind Via

A conductive surface hole that connects an outer layer with an inner layer of a multi layer board without penetrating the entire board.

 

Blister

A localized swelling and separation between any of the layers of a laminated base material, or between base material or conductive foil. It is a form of delamination.

 

Board Thickness

The overall thickness of the base material and all conductive material deposited thereon.

 

Bond Strength

The force per unit area required to separate two adjacent layers of a board by a force perpendicular to the board surface.

 

Border Area

The region of a base material that is external to that of the end product being fabricated within it.

 

Bow

The deviation from flatness of a board characterized by a roughly cylindrical or spherical curvature such that if the board is rectangular, its four corners are in the same plane.

 

B-Stage

An intermediate stage in the reaction of a thermosetting resin in which the material softens when heated and swells, but does not entirely fuse or dissolve, when it is in contact with certain liquids.

 

Built-In Self Test

An electrical testing method that allows the tested devices to test itself with specific added-on hardware.

 

Buried Via

A via hole drilled through inner-layers of a multilayer board that does not extend to the surface layers.

 

Burn-In Testings

Burn-In Testing is a thermal test method where products are powered on for extended periods to ensure product functionality.

 

Burr

A ridge left on the outside copper surface after drilling.

 

 

 

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