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PCB Glossary-9
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G10

A laminate consisting of woven epoxy-glass cloth impregnated with epoxy resin under pressure and heat. G10 lacks the anti-flammability properties of FR-4. Used mainly for thin circuits such as in watches.

 

Gerber File

Data file used to control a photo plotter.

 

GI

The woven glass fiber laminate impregnated with polyimide resin.

 

Gold Finger

The gold-plated terminal of a card-edge connector. Also see Finger.

 

Golden Board

See Known Good Board.

 

Ground

A common reference point for electrical circuits returns, shielding or heat sinking.

 

Ground Plane

A conductive plane as a common ground reference in a multilayer board for current returns of the circuit elements and shielding.

 

HASL C (Hot Air Solder Leveling)

A method of coating exposed copper with solder by inserting a panel into a bath of molten solder then passing the panel rapidly past jets of hot air.

 

HDI - (High Density Interconnect)

Ultra fine-geometry multi-layer PCB constructed with conductive micro-via connections. These boards also usually include buried and/or blind vias and are made by sequential lamination.

 

Header

The portion of a connector assembly which is mounted on a printed circuit.

 

Hermetic

Airtight sealing of an object.

 

Hole Breakout

A condition in which a hole is not completely surrounded by the land.

 

Hole Density

The number of holes per unit area on a PCB.

 

Hole Pattern

The arrangement of all holes in a printed board with respect to a reference point.

 

 

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